| 摘要 |
<p>The present invention relates to a mounting apparatus (30) for mounting an electronic part (3) utilizing ultrasonic wave and thermocompression bonding to form a flip-chip bonding system, comprising an ultrasonic vibration generating device (8), a horn (7) attached to the ultrasonic vibration generating device (8), a collet tool (6) for holding an electronic part (3) attached to the horn (7), a control unit (9) being connected to the ultrasonic vibration generating device (8), and a substrate conductor heating unit (4) connected to said control unit (9). To inspect the state of the formed joint, a vibrating measuring device (21) for monitoring a vibrating state of the electronic part (3) or the bump (5) is connected with the control unit (9). Thus, it is possible to measure a vibrating state of the electronic part (3) at the time of mounting is and to compare it with a reference wave form, to make a judgment as to whether or not an ultrasonic vibration is applied normally, and to judge the connection as defective or non-defective in accordance with the judgment on the ultrasonic vibration application. <IMAGE></p> |
