| 摘要 |
An apparatus comprises a die assembly including a plurality of dies held on a movable table, and a driving device for moving the die assembly. The driving device is operable to move the die assembly in a direction transverse to the axis of a punch for allowing one of the dies to be placed in a position located axially below the punch. The driving device is also operable to move the die assembly in the axial direction of the punch between raised and lowered positions. In the raised position, the die assembly can be moved by the driving device to place a selected die below the punch. In the lowered position, the selected die can be fixed in a die mounting hole located below the punch. In this position, the punch is operable to join workpieces by riveting, for example.
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