发明名称 |
Methods and apparatus for controlling electrolyte flow for uniform plating |
摘要 |
The present invention provides apparatus and methods for controlling flow dynamics of a plating fluid during a plating process. The invention achieves this fluid control through use of a diffuser membrane. Plating fluid is pumped through the membrane; the design and characteristics of the membrane provide a uniform flow pattern to the plating fluid exiting the membrane. Thus a work piece, upon which a metal or other conductive material is to be deposited, is exposed to a uniform flow of plating fluid.
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申请公布号 |
US6964792(B1) |
申请公布日期 |
2005.11.15 |
申请号 |
US20010927740 |
申请日期 |
2001.08.10 |
申请人 |
NOVELLUS SYSTEMS, INC. |
发明人 |
MAYER STEVEN T.;STOWELL R. MARSHALL;PATTON EVAN E.;VARADARAJAN SESHASAYEE |
分类号 |
B05C3/00;B05D1/18;C25D5/00;C25D5/08;C25D7/12;C25D17/00;(IPC1-7):B05C3/00 |
主分类号 |
B05C3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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