发明名称 Sealed electronic module with seal-in-place connector header
摘要 A sealed electronic module includes a housing having an open end for receiving a circuit board, and a slotted side wall for receiving a connector header mounted on the circuit board. The connector header fits snugly in the side wall slot and includes an integral trough that engages the interior face of the side wall to form a U-shaped channel that surrounds the sides and bottom of the slot. The housing is positioned with its open end upward, and potting material is dispensed onto the exposed surface of the circuit board in a single step to seal the circuit board to the housing. A portion of the potting material flows into and fills the U-shaped channel to seal the connector header to the housing.
申请公布号 US6964575(B1) 申请公布日期 2005.11.15
申请号 US20050053129 申请日期 2005.02.08
申请人 DELPHI TECHNOLOGIES, INC. 发明人 SAILOR STEVEN L.
分类号 H01R12/00;H01R13/52;H05K3/28;H05K5/00;H05K5/06;(IPC1-7):H01R12/00 主分类号 H01R12/00
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