| 摘要 |
An epoxy resin composition which is excellent in flowability, adhesion to substrates, flame retardancy, and soldering crack resistance without containing any brominated organic compound or antimony compound. The epoxy resin composition, which is for semiconductor encapsulation, is characterized by comprising as essential ingredients a phenol aralkyl type epoxy resin having a biphenyl skeleton, a phenol aralkyl resin having a biphenyl skeleton, a curing accelerator, an inorganic filler, a specific silane coupling agent having a secondary amine, and a specific silane coupling agent having a mercapto group.
|
