发明名称 PHOTORESIST RESIN COMPOSITION
摘要 The invention provides photoresist resin compositions and in particular, a photoresist resin compositions comprising a) an acrylate monomer having two urethane bonds, b) a crosslinkable urethane monomer having at least two ethylene double bonds, c) an alkali-soluble compound, d) a photopolymerization initiator and e) a solvent, and a photoresist dry film resists using the photoresist resins. The photoresist resin compositions and the photoresist dry film resists using the same in accordance with the invention have excellent adhesion to a substrate and sandblast resistance and at the same time, they have high sensitivity as well as high resolution, thereby enabling fine pattern formation on substrates.
申请公布号 KR20050107121(A) 申请公布日期 2005.11.11
申请号 KR20040032321 申请日期 2004.05.07
申请人 DONGJIN SEMICHEM CO., LTD. 发明人 KIM, BONG GI;RYU, SUNG MUN;PARK, SEONG MO;PARK, CHAN SEOK
分类号 G03F7/027;G03C1/492;G03F7/004;G03F7/029;G03F7/038;G03F7/11;H01J9/02;H01J11/22;H01J11/34;H01J11/36;(IPC1-7):G03F7/027 主分类号 G03F7/027
代理机构 代理人
主权项
地址