发明名称 MEMS DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method or the like of a MEMS element capable of forming the MEMS element while preventing erosion of a semiconductor element in the case of manufacturing a MEMS device wherein the MEMS element such as a micro resonator and the semiconductor element are formed on one and same substrate. SOLUTION: The manufacturing method of the MEMS device 80 wherein the MEMS element 10 and the semiconductor element 70 are formed on the substrate 50 includes the steps of: forming the semiconductor element 70 on the substrate 50; forming an acid resistance protection film 72 on the semiconductor element 70; and forming the MEMS element on the substrate 50. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005318043(A) 申请公布日期 2005.11.10
申请号 JP20040130869 申请日期 2004.04.27
申请人 SEIKO EPSON CORP 发明人 NAKAJIMA TAKUYA
分类号 B81B3/00;B81B7/02;B81C1/00;H03H3/007;H03H9/24;(IPC1-7):H03H9/24 主分类号 B81B3/00
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