发明名称 |
MEMS DEVICE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method or the like of a MEMS element capable of forming the MEMS element while preventing erosion of a semiconductor element in the case of manufacturing a MEMS device wherein the MEMS element such as a micro resonator and the semiconductor element are formed on one and same substrate. SOLUTION: The manufacturing method of the MEMS device 80 wherein the MEMS element 10 and the semiconductor element 70 are formed on the substrate 50 includes the steps of: forming the semiconductor element 70 on the substrate 50; forming an acid resistance protection film 72 on the semiconductor element 70; and forming the MEMS element on the substrate 50. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2005318043(A) |
申请公布日期 |
2005.11.10 |
申请号 |
JP20040130869 |
申请日期 |
2004.04.27 |
申请人 |
SEIKO EPSON CORP |
发明人 |
NAKAJIMA TAKUYA |
分类号 |
B81B3/00;B81B7/02;B81C1/00;H03H3/007;H03H9/24;(IPC1-7):H03H9/24 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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