| 摘要 |
PROBLEM TO BE SOLVED: To provide sealing and a sealing method that are suitable for hermetical sealing to correspond with the downsizing of an electronic device, a piezoelectric device or an elastic surface wave device. SOLUTION: The electronic part container has a hermetic container structure that is formed by bonding a container and a lid. The lid is made of particulate of several nano meters, and a dispersing material that can be bonded with the metallic particulate. COPYRIGHT: (C)2006,JPO&NCIPI
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