发明名称 METHOD FOR MANUFACTURING SHEET PROVIDED WITH IC TAG, APPARATUS FOR MANUFACTURING SHEET PROVIDED WITH IC TAG, SHEET PROVIDED WITH IC TAG, METHOD FOR FIXING IC CHIP, APPARATUS FOR FIXING IC CHIP, AND IC TAG
摘要 <p>A method for manufacturing a sheet (1) having an IC tag is provided with a process of preparing and supplying a conductor formed sheet (21a), a process of coating the conductor formed sheet (21a) with an adhesive (18), a process of preparing a multitude of IC chips (20) and sequentially supplying them, a process of sequentially arranging each IC chip (20) on the conductor (22), and a process of fixing each IC chip on the conductor (22) through the adhesive (18). The conductor formed sheet (21a) is provided with a nonconductor sheet (21) and a pair of the conductors (22). The pair of conductors (22) of the conductor formed sheet (21a) are provided on the nonconductor sheet (21), extend in a feeding direction and separate from each other.</p>
申请公布号 WO2005106778(A1) 申请公布日期 2005.11.10
申请号 WO2005JP07630 申请日期 2005.04.21
申请人 DAI NIPPON PRINTING CO., LTD.;SUGURO, HIROSHI;SAKATA, HIDETO;TSUCHIYA, TERUNAO;SHIMOMURA, TAKAICHI 发明人 SUGURO, HIROSHI;SAKATA, HIDETO;TSUCHIYA, TERUNAO;SHIMOMURA, TAKAICHI
分类号 B42D15/10;G06K19/00;G06K19/07;G06K19/077;H01L21/00;H01L21/60;H01L21/607;H01L23/498;(IPC1-7):G06K19/00 主分类号 B42D15/10
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