| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper-clad laminated film which has high adhesive strength and is reduced in warpage and curling and good in migration resistance characteristics and a method for producing the film simply, economically, and stably. SOLUTION: In the copper-clad laminated film, a polyimide benzooxazole film which comprises the residues (a) of aromatic diamines having a benooxazole structure in an amount of 5-95 mole% of the total diamine components and the residues (b) of aromatic diamines having a diphenyl ether structure in an amount of 95-5 mole% of the total diamine components [the sum of the residues (a) and the residues (b) is at least 60 mole% of the total diamine components] and the residues (c) of aromatic tetracaroxylic anhydrides and has a linear expansion coefficient of 11-20 ppm/°C, a tensile modulus of elasticity of at least 5 GPa, and a thickness of 1-100μm and copper foil 1-250μm in thickness are laminated without laying an adhesive between them. COPYRIGHT: (C)2006,JPO&NCIPI |
