| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a uniform Ti-Ni alloy film having no pinholes and voids. SOLUTION: In a prestage to plating, after stirring, the stirring is stopped, thus Ti particles are deposited on the surface of a cathode electrode (the object to be plated). Thereafter, plating is applied thereto in an Ni plating bath, thus a film in which the Ti particles are dispersed into an Ni plating film can be formed. The film in which Ni and Ti are coexistent is subjected to melting or solid phase diffusion by heating, thus the Ti-Ni alloy film can be obtained. COPYRIGHT: (C)2006,JPO&NCIPI
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