| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact piezoelectric oscillator where a piezoelectric element board is directly loaded and air-tightly sealed through a bump on a conductive pad, and its manufacturing method. SOLUTION: This method for manufacturing a piezoelectric oscillator wherein a piezoelectric element board is supported and air-tightly sealed through a bump on a conductive pad on an insulating substrate in a container comprises a process to deposit electrode materials on the piezoelectric element board, a process to heat the piezoelectric element board, a process to selectively remove base electrode materials dispersed to a piezoelectric element board electrode, and deposited to the electrode surface of the piezoelectric element board by dry etching, a process to load the piezoelectric element board through the bump on the piezoelectric oscillator container at a place where the base electrode materials are removed and a process to adjust the frequency of the piezoelectric oscillator. A base electrode material deposit layer deposited on the piezoelectric element board surface is formed by directly melting and jointing the electrode materials and the bump at the place where the base electrode materials are selectively removed by dry etching. COPYRIGHT: (C)2006,JPO&NCIPI
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