| 摘要 |
An image sensor package and method of assembling the same utilizes an overlay pattern containing multiple lens mounts and a glass plate to laid over a substrate. The substrate has multiple chip pads formed at predetermined locations for holding sensor ICs. Each lens mount is positioned on the periphery of the chip pad and completely sealed off by a glass plate The stacked layers are then cut vertically to form individual blocks, completely detached to form image sensor packages.
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