| 摘要 |
An embedded chip semiconductor has a substrate, at least one chip, an insulation boundary and a circuit pattern. The substrate has a thickness, a top surface, a bottom surface and at least one chip recess. The at least one chip has a thickness, a top face, a bottom face, outer edges and multiple terminals and is mounted in a corresponding chip recess. The thickness of the chip is equal to or less than the thickness of the substrate. The insulation boundary is formed in the chip recess around the edges of the chip. The circuit pattern is formed on the bottom surface of the nonmetallic substrate and connected to the multiple terminals of the chip. Therefore, a printed circuit board making process is employed to mass-produce the semiconductors. Further, the chip connected to the circuit pattern does not the wire bondings so the semiconductor fabrication process has good yield.
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