| 摘要 |
PROBLEM TO BE SOLVED: To provide fine conductive particulates not generating mutual coagulation of themselves, nor bridging and clogging in a hopper of a mounter, and to provide a conductive structure conductively connected by using the conductive particles. SOLUTION: The conductive fine particulate is formed by coating a metal having low melting point on a basic fine particulates (1). An indentation of which, the height (5) is 2 to 20% of a diameter (4) of a circumcircle (3) of the conductive fine particulate is formed on the conductive fine particulate. Preferably, the basic fine particle has an average diameter of 5 to 800μm, aspect ratio of 1:1 or less, and CV value of 5% or less. Preferably the metal having low melting point is made of tin-silver group alloy. A conductive connection structure using the conductive fine particulate is provided. COPYRIGHT: (C)2006,JPO&NCIPI
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