LED BONDING STRUCTURES AND METHODS OF FABRICATING LED BONDING STRUCTURES
摘要
An LED chip includes a bond pad suitable for thermosonic or thermocompression bonding such as Sn, AuSn or other metals. The physical dimensions of the bond pad are selected to discourage or prevent solder squeeze-out during thermocompression or thermosonic bonding with or without flux. In some embodiments, an AuSn bond pas is designed to accept 30g to 70g of force or more without squeeze-out.
申请公布号
WO2005106497(A2)
申请公布日期
2005.11.10
申请号
WO2005US14493
申请日期
2005.04.27
申请人
CREE, INC.;SLATER, DAVID, BEARDSLEY, JR.;EDMOND, JOHN, ADAM