ELECTRONIC COMPONENT HOLDER, ITS MANUFACTURING PROCESS, AND METHOD FOR TAKING OUT ELECTRONIC COMPONENT FROM ELECTRONIC COMPONENT HOLDER

摘要

PROBLEM TO BE SOLVED: To provide an electronic component holder capable of suppressing complication of arrangement or manufacturing process and eliminating possibility of cost increase or generation of a lot of wastes, and to provide its manufacturing process, and a method for removing an electronic component from the electronic component holder.

SOLUTION: The electronic component holder comprises a supporting substrate 1, and an elastic elastomer layer 3 formed on the surface of the supporting substrate 1 and tightly holding a silicon wafer W removably. A plurality of conduction passages 2 of air for partially deforming the flat surface of the elastomer layer 3 are bored through the supporting substrate 1 in the internal thickness direction.

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