发明名称 LED heat-radiating substrate and method for making the same
摘要 An LED heat-radiating substrate and a method for making the same are proposed. The LED heat-radiating substrate has a low expansion layer body and two high thermal conductivity layer bodies formed at its two sides. Through mutual connection and containment of these layer bodies, the requirements of high heat-radiating effect and low expansion can be met. An LED structure can be arranged on the heat-radiating substrate to accomplish a high heat-radiating effect. Moreover, damage to the LED structure due to thermal expansion of the heat-radiating substrate can be avoided.
申请公布号 US2005247945(A1) 申请公布日期 2005.11.10
申请号 US20040841639 申请日期 2004.05.10
申请人 UNITED EPITAXY COMPANY, LTD. 发明人 CHANG CHIH-SUNG;CHEN TZER-PERNG
分类号 H01L27/15;H01L33/64;H01S5/024;(IPC1-7):H01L27/15 主分类号 H01L27/15
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