发明名称 |
LED heat-radiating substrate and method for making the same |
摘要 |
An LED heat-radiating substrate and a method for making the same are proposed. The LED heat-radiating substrate has a low expansion layer body and two high thermal conductivity layer bodies formed at its two sides. Through mutual connection and containment of these layer bodies, the requirements of high heat-radiating effect and low expansion can be met. An LED structure can be arranged on the heat-radiating substrate to accomplish a high heat-radiating effect. Moreover, damage to the LED structure due to thermal expansion of the heat-radiating substrate can be avoided.
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申请公布号 |
US2005247945(A1) |
申请公布日期 |
2005.11.10 |
申请号 |
US20040841639 |
申请日期 |
2004.05.10 |
申请人 |
UNITED EPITAXY COMPANY, LTD. |
发明人 |
CHANG CHIH-SUNG;CHEN TZER-PERNG |
分类号 |
H01L27/15;H01L33/64;H01S5/024;(IPC1-7):H01L27/15 |
主分类号 |
H01L27/15 |
代理机构 |
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代理人 |
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地址 |
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