| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition capable of suitably being used for producing a printed board, etc., and having superior adhesion, processability, heat resistance, and, furthermore, superior resin flowability and dielectric characteristic at a GHz zone, and to provide its representative application technology. SOLUTION: This thermosetting resin composition comprises a polyimide resin component (A), an epoxy resin component (B) and a hardener component (C) for the epoxy resin. The each components described above are formulated so that the total mole of an epoxy group contained in the thermosetting resin composition and a hydroxyl group caused by its ring opening reaction is≤0.2 mole/100 g. Furthermore, the epoxy resin component (B) comprises at least a low viscosity epoxy resin that has an ICI viscosity of≤0.5 Pa s at 150°C. Thereby, many balanced and good characteristics such as adhesion are provided for the thermosetting resin composition and its hardened resin. COPYRIGHT: (C)2006,JPO&NCIPI |
