| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device, of which the passivation layer is not damaged by the probe needle of an inspection device. <P>SOLUTION: The semiconductor device has a semiconductor chip 1, that is formed with a passivation layer 4 and electrode pads 3 on the upper surface thereof, wherein electrode pads 3 are provided with auxiliary electrode pads for test 3a which extends in the sliding direction of the probe needle n for testing characteristics using the electrode pads 3, and openings for exposing the electrode pads 3 and auxiliary electrode pads for test 3a are provided on the passivation layer 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
