发明名称 MANUFACTURING METHOD FOR LAMINATED COIL PART
摘要 PROBLEM TO BE SOLVED: To obtain a manufacturing method for a laminated coil part having the small DC resistance of a via hole constituting the coil being easily manufactured and having a high yield. SOLUTION: Through-holes 21 to 24 are formed so that the through-holes are mutually superposed partially and diameters are reduced gradually towards the ends of connecting conductors 65 and 66 successively so as to be superposed to the forming regions of the beltlike connecting conductors 65 and 66 in ceramic green sheets 63 and 64. The connecting conductors 65 and 66 are formed of conductive paste while the through-holes 21 to 24 are filled with conductive paste and the via hole 65a is formed. Accordingly, the widths of the outer peripheral section of the via hole 65a is ensured in the connecting conductors 65 and 66, the defective filling of conductive paste into the via hole 65a is reduced, and the yield on the manufacture of the laminated coil part is improved. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005317876(A) 申请公布日期 2005.11.10
申请号 JP20040136664 申请日期 2004.04.30
申请人 MURATA MFG CO LTD 发明人 OMORI ATSUKO
分类号 H01F41/04;H01F17/00;H01F17/02;(IPC1-7):H01F41/04 主分类号 H01F41/04
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