POLYIMIDE FILM AND COPPER-CLAD LAMINATE USING THE SAME AS SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a polyimide film having excellent dimensional stability and suitable for a substrate for a fine pitch circuit board, especially a COF (chip on film) wired at a narrow pitch in the film width direction and to provide a copper-clad laminate using the same film as a substrate. SOLUTION: The polyimide film is characterized as having 3-10 ppm/°C coefficient of thermal expansionαMDin the mechanical transporting direction (MD) of the film and 10-20 ppm/°C coefficient of thermal expansionαTDin the transverse direction (TD). The copper-clad laminate is characterized in that the copper of 1-10μm thickness is formed on the polyimide film as the substrate. COPYRIGHT: (C)2006,JPO&NCIPI