| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC part for an oscillation circuit and a piezoelectric oscillator which prevents a parasitic capacity generated at the connection pad side of the IC sides from bringing a characteristic defect of the oscillator, by intervening in a piezoelectric oscillation element and the oscillation circuit when the IC constituting the oscillation circuit or the like is mounted on an external electrode set in the insulating vessel of a piezoelectric transducer or the like by a flip chip connection. SOLUTION: The piezoelectric oscillator is provided with: the piezoelectric transducer 1 to tightly seal the piezoelectric oscillation element 11 in the insulating vessel 2; an IC storage 4 either to extensively a part of the insulating vessel or to be outside-attached to the insulating vessel; and the IC for the oscillation circuit provided with the external electrode 20a for the transducer stored in the IC storage, and also conducted through the piezoelectric oscillation element and a transducer connecting pad 31a connected by using a conductive bump 35. A shape of the transducer connecting pad provided in the IC is formed as an around shape whose diameter is a little larger than a conductive bump diameter used, or as a polygon. COPYRIGHT: (C)2006,JPO&NCIPI
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