| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for accommodating electronic parts capable of performing connection work of the lead wires between an input/output terminal and a thermoelectric cooling element certainly and efficiently with sufficient workability, and accordingly capable of operating, normally and stably for a long period of time, a thermoelectric cooling element, and electronic parts which are accommodated in the inside; and to provide its manufacturing method, and an electronic device. SOLUTION: The package for accommodating electronic parts is provided with a base 1 with a placing part 1a where electronic parts 10 are laid in the upside principal surface via a thermoelectric cooling element 11, a frame 3 attached so that the placing part 1a might be surrounded in the upside principal surface of base 1, an input/output terminal 4 has the terminal area of the lead wire 14 of the thermoelectric cooling element 11 in a metalizing wiring layer 4a and is fitted to the frame 3. The terminal area of input/output terminal 4 comprises a cutout 4b provided by penetrating the upper and lower sides in the formation part of the metalizing wiring layer 4a of the frame 3 inner side. The lead wire 14 is joined via a high melting point wax material 14b by forming an expanded part 14a at its head. COPYRIGHT: (C)2006,JPO&NCIPI
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