| 发明名称 |
Reworkable b-stageable adhesive and use in waferlevel underfill |
| 摘要 |
A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled miocroelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this material.
|
| 申请公布号 |
US2005250248(A1) |
申请公布日期 |
2005.11.10 |
| 申请号 |
US20050154794 |
申请日期 |
2005.06.15 |
| 申请人 |
|
发明人 |
BUCHWALTER STEPHEN L.;FEGER CLAUDIUS;HOUGHAM GARETH;LABIANCA NANCY;SHOBHA HOSADURGA |
| 分类号 |
C08G65/26;H01L21/56;H01L23/29;(IPC1-7):H01L21/44 |
主分类号 |
C08G65/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
