| 摘要 |
The invention provides a heat dissipation structure for electronic devices that can improve heat dissipation efficiency, while making use of the natural features of a wooden material as a covering member. The invention is related to a heat dissipation structure for the electronic device 1, the covering members 2 and 3 of which are made of a compressed wooden material, and is characterized by exposing outside a portion of the metal heat dissipation frame 20 provided inside. Because of this, the heat generated inside of the electronic device 1 is dissipated outside through the heat dissipation frame 20 with high heat conductivity from the portion of the heat dissipation frame 20 exposed outside. |
