| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer polishing apparatus capable of eliminating inconvenience such as causing any scratch in a wafer and contaminating the wafer. <P>SOLUTION: The wafer polishing apparatus polishes a wafer by holding the wafer W on a holding head 14 and pressing the wafer to a polishing pad 20 via the holding head. The holding head comprises a protective sheet 52 for pressing the wafer to the polishing pad, a retainer 28 for holding the circumference of the protective sheet, and a carrier 24 for pressing the protective sheet of a part corresponding to a wafer region toward the wafer via fluid pressure. The protective sheet consists of a perforated sheet or a permeable sheet. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
