| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition free of occurrence of film defects even in the case of a thick film, excellent in heat resistance, mechanical characteristics, workability and electrical properties, and capable of forming a high resolution circuit pattern. <P>SOLUTION: The photosensitive resin composition contains (A) a polybenzoxazole precursor having a repeating unit shown by formula (1) (where A<SB>1</SB>represents a tetravalent aromatic group; A<SB>2</SB>represents a divalent organic group; and n is a number of 2-300), (B) a compound having at least two vinyl ether groups in one molecule, and (C) a compound which generates an acid upon irradiation with an active energy line. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
