| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology capable of preventing occurrence of cracks when a piezoelectric vibration chip is broken off and occurrence of a short-circuit in the case of mounting the chip to a package. SOLUTION: A pair of connection electrodes 50a, 50b is formed at a base 32 of the tuning fork piezoelectric vibration chip 30. The base 32 of the tuning fork piezoelectric vibration chip 30 is connected to a frame 38 of a wafer 10 via a plurality of connection parts 36. One of a plurality of the connection parts 36 is formed at a position corresponding to a separation part 56 formed between a pair of the connection electrodes 50a, 50b. The tuning fork piezoelectric vibration chip 30 is separated from the frame 38 by breaking off the connection parts 36. COPYRIGHT: (C)2006,JPO&NCIPI
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