| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive paste with excellent conductivity, adhesive strength and migration resistance. SOLUTION: This conductive paste contains conductive powder and a binder component. The conductive powder comprises metal powder wherein a surface of copper powder or copper alloy powder is partially covered with silver, and comprises mixed powder of the nearly spherical metal powder and the nearly flat metal powder or single powder of the nearly spherical metal powder and the nearly flat metal powder. The binder component contains a mixture of an epoxy resin and an imidazole compound having a carboxyl group. COPYRIGHT: (C)2006,JPO&NCIPI |
