发明名称 SPUTTERING TARGET, AND SPUTTERING METHOD USING THE TARGET
摘要 PROBLEM TO BE SOLVED: To solve a problem that a target made by a prior art leaves its peripheral part unsputtered and consequently uneroded, when sputtered after having been mounted on a sputtering apparatus and surrounded by an earth shield, because when plasma is generated, an electric current passes to the earth shield from the target and the plasma is not formed on the surface of the peripheral part of the target. SOLUTION: The sputtering target T has a predetermined outer shape which has a slope T2 formed on the whole periphery at which a sputtered surface intersects with a peripheral wall surface. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005314773(A) 申请公布日期 2005.11.10
申请号 JP20040136145 申请日期 2004.04.30
申请人 ULVAC JAPAN LTD 发明人 ARAI MAKOTO;ISHIBASHI AKIRA;KOMATSU TAKASHI;TANI NORIAKI;KIYOTA JUNYA;OTA ATSUSHI;SUGIURA ISAO;NAKAMURA KYUZO
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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