发明名称 LAMINATED DAMPING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a damping structure capable of forming a stable damping structure and showing satisfactory damping effects against a damped member with a thick plate. SOLUTION: In the damping structure that keeps a binding plate 3 stuck on the damped member 1 via an adhesive layer 2, the adhesive layer 2 is a liquefied object before curing it, and the liquefied object is uniformly applied on stuck faces between the damped member 1 and binding plate 3. After sticking them together, the adhesive layer 2 is formed by curing the adhesive layer with a curing agent, water in air, or oxygen. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005315281(A) 申请公布日期 2005.11.10
申请号 JP20040130917 申请日期 2004.04.27
申请人 SHINKO ELECTRIC CO LTD 发明人 KONDO HIROYUKI
分类号 F16F15/02;(IPC1-7):F16F15/02 主分类号 F16F15/02
代理机构 代理人
主权项
地址