| 摘要 |
In general, in one aspect, the invention features methods that include interferometrically monitoring a distance between an interferometry assembly and a measurement object along each of three different measurement axes while moving the measurement object relative to the interferometry assembly, determining values of a first parameter and a second parameter for different positions of the measurement object from the monitored distances, wherein for a given position the first parameter is based on the monitored distances of the measurement object along each of the three different measurement axes at the given position, and for a given position the second parameter is based on the monitored distance of the measurement object along each of two of the measurement axes at the given position, and deriving information about a surface figure profile of the measurement object from the first and second parameter values.
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