| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a connection terminal which has superior connection reliability after a heat treatment, and to provide a semiconductor package using the connection terminal, and a method for manufacturing the semiconductor package. <P>SOLUTION: The connection terminal has an electroless palladium plating film and an electroless gold plating film formed in order on the surface of a wiring conductor and also has a solder ball fused thereupon. The semiconductor package comprises a substrate which supports the wiring conductor, a semiconductor chip, and a connection conductor connecting the semiconductor chip and wiring conductor. Also, the method is provided for manufacturing the semiconductor package. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
