发明名称 |
Method and system for problem case packaging |
摘要 |
A method of problem case packaging handling consists collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and being associated with manufacturing problem information related to that problem case.
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申请公布号 |
US2005251277(A1) |
申请公布日期 |
2005.11.10 |
申请号 |
US20040839426 |
申请日期 |
2004.05.05 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
KUO WEN-CHANG;HUANG CHIEN-CHUNG;CHIANG TIEN-DER;HUANG YI-LIN;CHEN CHUN YI;WANG DAN-RU |
分类号 |
G06F19/00;(IPC1-7):G06F19/00 |
主分类号 |
G06F19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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