发明名称 Method and system for problem case packaging
摘要 A method of problem case packaging handling consists collecting manufacturing problem information from entities associated with fabrication of a semiconductor product; and distributing the manufacturing problem information into problem cases which are stored in a problem database, each problem case representing a respective manufacturing problem and being associated with manufacturing problem information related to that problem case.
申请公布号 US2005251277(A1) 申请公布日期 2005.11.10
申请号 US20040839426 申请日期 2004.05.05
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 KUO WEN-CHANG;HUANG CHIEN-CHUNG;CHIANG TIEN-DER;HUANG YI-LIN;CHEN CHUN YI;WANG DAN-RU
分类号 G06F19/00;(IPC1-7):G06F19/00 主分类号 G06F19/00
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