| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an interposer whereby such electronic components as an IC chip are prevented from generating their cracks caused by their thermal expansions and heat contractions, and their power supplies can stably be fed to them. <P>SOLUTION: The interposer 60 has a base substrate 61 formed out of a ceramics, and has a plurality of conductor vias 62 so passed through both sides of the base substrate 61 as to connect electrically an IC chip 70 connected with one of both sides with a printed wiring board 10 connected with the other of both sides. An aspect ratio Rasp of each conductor via 62 is not smaller than 4, and its diameter exceeds 30μm. Further, the aspect ratio Rasp of each outside conductor via 62a of the conductor vias 62 which is disposed in the peripheral edge of the base substrate 61 is not smaller than the aspect ratio Rasp of each inside conductor via 62b disposed in the central portion of the base substrate 61. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
