| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer interconnection board superior in high-frequency characteristics and reliability with proper productivity. SOLUTION: The multilayer interconnection board has an insulating layer comprising a liquid crystal polymer, a conductive circuit formed by being embedded in the insulating layer, and an inter-layer connection conductive post formed on the conductive circuit layer by penetrating the insulating layer. The manufacturing method of the multilayer interconnection board comprises a process of forming a conductive circuit by electrolytic plating with a metal plate or a metal foil as electrolytic plating leads on the metal plate or the metal foil; a process of forming the insulating layer comprising the liquid crystal polymer on the conductive circuit; a process of forming a via on the insulating layer so as to allow a part of the conductive circuit to be exposed; and a process of forming the conductive post and a soldering layer, by performing electrolytic plating inside the via with the metal plate or the metal foil as the electrolytic plating leads. COPYRIGHT: (C)2006,JPO&NCIPI |
