| 发明名称 |
Manufacturing tool for wafer level package and method of placing dies |
| 摘要 |
A tool of wafer level package comprises a first base, an elastic material and a second base. The elastic material is coated on the first base, and the elastic material has viscosity in common state to adhere a plurality of dies. The second base is coated by adhesive material to adhere the dies. The plurality of dies are departed from the elastic material by a special environment after adhering.
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| 申请公布号 |
US2005249945(A1) |
申请公布日期 |
2005.11.10 |
| 申请号 |
US20040842959 |
申请日期 |
2004.05.10 |
| 申请人 |
YANG WEN KUN;YANG WEN PING;CHEN SHIH LI |
发明人 |
YANG WEN KUN;YANG WEN PING;CHEN SHIH LI |
| 分类号 |
H01L21/60;B23P19/00;B44C1/00;C09J1/00;H01L21/00;H01L21/44;H01L21/50;H01L21/58;H01L21/68;H01L21/82;H01L23/31;(IPC1-7):B44C1/00;B32B31/00 |
主分类号 |
H01L21/60 |
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