| 摘要 |
A plating apparatus has a frame configured to be placed on a substrate so that a plating bath is formed by the frame and the substrate. The frame includes a conductive core and a seal member covering the conductive core. The plating apparatus also has a non-conductive porous member configured to be immersed in an electrolytic plating solution held in the plating bath, a counter electrode disposed on the non-conductive porous member so as to face the substrate with a predetermined distance from the substrate, and a feed contact configured to be brought into contact with a peripheral portion of the substrate outside of the frame. The plating apparatus includes a power source operable to apply a voltage between the counter electrode and the substrate and a potential adjuster operable to control a potential of the conductive core of the frame with respect to a potential of the substrate. |
