| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain positional information concerning a cubicle terminal provided to an electrode in a way that no wiring is damaged when the electrode electrically connected to the outside of the bottom layer of a multilayer wiring board are subject to external impact. <P>SOLUTION: On a wiring board 10, semiconductor devices fixed by the adhesive are interconnected with thin metal lines for electrical connection to the outside and the top is entirely sealed with resin. A cubicle terminal 6 is mounted on an electrode 5 exposed by a concave on this wiring board 10, then connected to the concave (electrode 5) of the wiring board 10 by heating and melting to form an external terminal. For this purpose, the electrode 5 to be electrically connected to the outside is formed on the multilayer wiring board 10a, a cylindrical hole is machined only at the location of a single layer board 10b which overlaps the electrode 5, and then the single layer board 10b and multilayer wiring board 10a are joined to form a concave on the wiring board 10. In this way, the misalignment of the cubicle terminal 6 can be prevented and the wiring below the single layer board 10b can be protected against external impact from the single layer board 10b. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
