Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method

摘要

A component having at least one conductor path on a substrate, and a production method for fabricating such a component is provided. The component is made by providing at least one conductor path on a predefined area of the substrate. Then a dielectric insulating layer is formed over the at least one conductor path, and a an area of the substrate is completely back etched below the at least one conductor path beginning on the bottom side of the substrate in such a way that the at least one conductor path is supported across the completely back-etched area of the substrate by adhesion to the second insulating layer.