SHEET PEELING APPARATUS AND PEELING METHOD

摘要

A peeling apparatus (10) is provided with a peeling table (11) for supporting a wafer (W) whereupon a sheet (S) is adhered, and a sheet peeling unit (12) arranged on an upper part of the peeling table (11). In the peeling apparatus, the sheet peeling unit (12) and the peeling table (11) are relatively shifted and the sheet (S) can be peeled. The peeling apparatus is also provided with a supporting roll (20) for a peeling tape (PT), first and second rolls (30, 31) for adhering the peeling tape (PT) on the surface of the sheet (S), and a take-up roll (21) for the peeling tape (PT). Peeling is performed under a condition where an initial peeling angle (alpha1) is formed by bending the peeling tape (PT) in a space (C) formed between the second roll (31) and the sheet (S), and then, the sheet (S) is peeled at a subsequent peeling angle (alpha2) corresponding to a diameter of the second roll (31).