SEMICONDUCTOR MECHANICAL QUANTITY SENSOR

摘要

PROBLEM TO BE SOLVED: To surely provide a movable part by etching in a semiconductor angular speed forming the movable part released from a support substrate by forming a trench by etching on a semiconductor layer supported on the support substrate.

SOLUTION: The angular speed sensor forms the trench 2 penetrating a thickness direction of the semiconductor layer by etching on the semiconductor layer supported on the support substrate, and is provided with the movable parts 20 and 30 partitioned by the trench 2 on the semiconductor layer and released from the support substrate. The angular speed sensor detects an application angular speed on the basis of a displaced state of the movable parts 20 and 30 when the angular speed is applied. Widths W1 of trenches 2a provided on the movable parts 20 and 30 from among the trenches 2 are ones so that an etching rate from among the sensor is the maximum.

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