发明名称 PUMP, COOLING SYSTEM AND ELECTRONIC EQUIPMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a pump capable of excellently cooling a heating element over a long period. <P>SOLUTION: A pump housing 101 has a heat receiving plate 122 thermally connected to a CPU 31 and a pump room 118. An impeller 102 for rotating by a motor 103 is arranged in the pump room 118. At least a part of the pump housing 101 is formed of resin mixed with at least one kind of filler of a filler composed of a material having a coefficient of linear expansion smaller than the resin and a filler composed of a material having steam permeability smaller than the resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005315158(A) 申请公布日期 2005.11.10
申请号 JP20040133536 申请日期 2004.04.28
申请人 TOSHIBA CORP 发明人 TOMIOKA KENTARO;HATA YUKIHIKO
分类号 F04D29/22;F04B17/00;F04B35/04;F04D5/00;F04D29/02;F04D29/42;F04D29/58;H05K7/20 主分类号 F04D29/22
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