发明名称 |
PUMP, COOLING SYSTEM AND ELECTRONIC EQUIPMENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pump capable of excellently cooling a heating element over a long period. <P>SOLUTION: A pump housing 101 has a heat receiving plate 122 thermally connected to a CPU 31 and a pump room 118. An impeller 102 for rotating by a motor 103 is arranged in the pump room 118. At least a part of the pump housing 101 is formed of resin mixed with at least one kind of filler of a filler composed of a material having a coefficient of linear expansion smaller than the resin and a filler composed of a material having steam permeability smaller than the resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005315158(A) |
申请公布日期 |
2005.11.10 |
申请号 |
JP20040133536 |
申请日期 |
2004.04.28 |
申请人 |
TOSHIBA CORP |
发明人 |
TOMIOKA KENTARO;HATA YUKIHIKO |
分类号 |
F04D29/22;F04B17/00;F04B35/04;F04D5/00;F04D29/02;F04D29/42;F04D29/58;H05K7/20 |
主分类号 |
F04D29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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