| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for easily forming a projection to stably apply thermoplastic resin, when a thermoplastic resin layer is provided on a semiconductor element or below the semiconductor device. SOLUTION: On a package circuit board 2a, multiple semiconductor elements 1 are mounted, and wiring on the package circuit board 2a and semiconductor elements 1 are electrically connected, using the metal thin lines 3 so that the enclosure of the semiconductor elements 1 can be sealed at once with resin 4a. Next, a projection electrode 5 is provided to the bottom of the package circuit board 2a, and a projection 7a is provided, in such a way that it bridges the semiconductor devices adjacent to the bottom of the package circuit board 2a. Then, a thermalplastic resin layer 6 containing flux is formed between the projection electrode 5 and the projection 7a through potting using a nozzle 8. After that, the projection 7a, formed so as to straddle the adjacent semiconductor devices, is divided at the same time, when division for packages takes place through dicing with a dicing blade 9. COPYRIGHT: (C)2006,JPO&NCIPI |
