发明名称 MULTILAYER WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a highly efficient multilayer wiring board capable of transmitting the signal of a high-speed semiconductor device correctly without malfunction, by suppressing distortion of an output signal wave, and delay of a signal. SOLUTION: The multilayer wiring board 1 comprises a signal line 4 formed so that line width, as it follows toward an outside, might increase gradually radially from the part opposite to an electrode pad 6, between the layers of a first or a third insulating layers 7a-7c laminated one by one on the principal surface of a substrate 2; and an opening 8 formed so that it might, as it follows toward an outside, an effective area product might become large gradually, while being arranged radially in the position which counters the signal line 4, formed in a lower grounding conductor 3 and an upper grounding conductor 5. While increasing the line width of the signal line 4 gradually and making wiring resistance low, it is made possible to suppress the variation of the characteristic impedance accompanied with the increase of line width within a predetermined limit. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005317587(A) 申请公布日期 2005.11.10
申请号 JP20040130886 申请日期 2004.04.27
申请人 KYOCERA CORP 发明人 SUWAWAKI YUJI
分类号 H05K1/02;H01L23/12;H05K3/46;(IPC1-7):H01L23/12 主分类号 H05K1/02
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