发明名称 METHOD FOR WINDING UP UNBAKED SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide an unbaked sheet winding method capable of accurately winding up an unbaked sheet such as a green sheet without generating flaws or holes on the unbaked sheet at the time of winding up the unbaked sheet around a roll body, and to provide a method for manufacturing electronic components prevented from the occurrence of a short circuit defect or the like. SOLUTION: An unbaked sheet 10a which will be a dielectric layer 10 and/or inner electrode layers 12, 14 after baking is formed on the surface of a support sheet 20. The support sheet 20 on which the unbaked sheet 10a is formed is wound up like a roll to form a roll body 29. At the time of winding up the support sheet 20 on which the unbaked sheet 10a is formed like a roll, a cushioning tape 30 with prescribed thickness is located on an area in which the unbaked sheet 10a is not formed on the surface of the support sheet 20. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005317747(A) 申请公布日期 2005.11.10
申请号 JP20040133569 申请日期 2004.04.28
申请人 TDK CORP 发明人 KANASUGI MASAAKI;ISHII SOICHIRO;SATO SHIGEKI
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/12 主分类号 H01G4/12
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