| 摘要 |
PROBLEM TO BE SOLVED: To provide a metallized film for an electromagnetic wave shield material which is thin and flexible, can be sufficiently adhered to an object to be shielded without a gap in which an evaporated silver layer is not deformed and damaged, and also, which does not impede the flexibility of the object to be shielded, can shield an electromagnetic wave at a high frequency of≥5.2 giga by the use of the evaporated silver layer of 0.03-0.3μm, and is excellent in workability when used for the shield of a wiring circuit part of a wiring circuit sheet (a wiring circuit board). SOLUTION: The metallized film for an electromagnetic wave shield material has the following characteristics that a release layer is formed on one face of a plastic film having a thickness of 10-100μm. A heat resistant and insulating resin layer having a thickness of 0.5-5μm is formed on the release layer. A metal thin film layer having a thickness of 0.32-5.0μm is formed on the resin layer. If required, an adhesive layer having a thickness of 2-15μm is formed on the metal thin film layer. COPYRIGHT: (C)2006,JPO&NCIPI
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