发明名称 |
Liquid wiping apparatus |
摘要 |
The present invention provides a liquid wiping apparatus that can eliminate the increase in the thickness of membranous liquid and defects in the surface quality resulting from the attachment of splash onto the surface of a metallic strip and can improve the productivity in a manner of accelerating the line speed. The liquid wiping apparatus according to this invention includes blade wipers for contacting with a molten metal having been attached onto the metallic strip 1 to mechanically wipe the molten metal. In the liquid wiping apparatus, a pressure applying means 7 of the static pressure pad type using gas is installed at the outlet side of the blade wiper 6 in the strip running direction, and phase-mixed flow of gas/liquid 15 is produced in membranous liquid running between the blade wiper 6 and the strop 1.
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申请公布号 |
US2005247262(A1) |
申请公布日期 |
2005.11.10 |
申请号 |
US20050092576 |
申请日期 |
2005.03.29 |
申请人 |
MITSUBISHI-HITACHI METALS MACHINERY, INC. |
发明人 |
YOSHIKAWA MASASHI;HIRANO TATSUYA;FUJIOKA HIRONORI;NAGAI TAKANORI |
分类号 |
C23C2/22;C23C2/20;(IPC1-7):B05C11/02;B05D3/04;B05D3/12 |
主分类号 |
C23C2/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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