RESIN SEALING SEMICONDUCTOR PACKAGE AND METHOD AND DEVICE FOR MANUFACTURING THE SAME

摘要

A resin sealing semiconductor package and a method and a device for manufacturing the semiconductor package. The method for sealingly molding the semiconductor package is characterized in that a powder or granular resin composition is agitated and molten in an agitating pot having a heating device by rotating an agitating plunger having an agitating bar projected from the tip thereof, the agitated and molten resin is taken out and pressurized in a package shape to manufacture a shaped resin, the shaped resin is mounted on a compression plunger in a drag cavity, and the compression plunger is pressurized after a mold is clamped. Thus, even ifa wire is reduced in size or made highly dense, the flow of the wire is hard to occur.